Sn99Ag0.3Cu0.7 Solder Paste, Flux, Lead-Free Solder Paste Free Cleaning Is Widely Used In All Kinds Of Soldering

HXP-603:       Sn:99%,Ag0.3%,Cu:0.7%           Melting point: 217℃/422.6℉

HXP-901-FLUX:Rosin,hydrogenated(44%),Solvent(44%),1H-Benzotriazole,Adipic acid(12%) 

HP-2015alloy

The ingredients of the above products are not controlled for rare metals!!!

Usage: Used for products with certain SMT processes or high temperature resistance
Flux:Lead free and halogen-free, with no resistance value, suitable for mobile phone repair, precision component repair, etc

Syringe design, easy to use, easy to weld, weld joints full of bright not false welding, widely used in component welding repair. Comes with its own flux for easy soldering and is an indispensable soldering supply for the soldering studio.

Lead-free solder paste, the paste is delicate and smooth, and the PCB should be preheated before soldering,The operating temperature is above 300 degrees Celsius