Sn99Ag0.3Cu0.7 Solder paste, flux, lead-free solder paste free cleaning is widely used in all kinds of soldering
Sn99Ag0.3Cu0.7 Solder paste, flux, lead-free solder paste free cleaning is widely used in all kinds of soldering
SPECIFICATIONS
Brand Name: NONE
Certification: REACH
Choice: yes
Does the product contain Bi？: No
HXP-603: Sn:99%,Ag0.3%,Cu:0.7%
HXP-604: Sn:96.5%,Ag3%,Cu:0.5%
High-concerned chemical: None
Model Number: HXP-603/HXP-604
Origin: Mainland China
semi_Choice: yes
weight: 10/35/55g
HXP-603: Sn:99%,Ag0.3%,Cu:0.7% Melting point: 217℃/422.6℉
HXP-604: Sn:96.5%,Ag3%,Cu:0.5% Melting point: 217℃/422.6℉
HXP-901-FLUX:Rosin,hydrogenated(44%),Solvent(44%),1H-Benzotriazole,Adipic acid(12%)
HP-2015alloy
The ingredients of the above products are not controlled for rare metals!!!
Lead-free solder paste, the paste is delicate and smooth, and the PCB should be preheated before soldering,The operating temperature is above 300 degrees Celsius
Usage: Used for products with certain SMT processes or high temperature resistance
Flux:Lead free and halogen-free, with no resistance value, suitable for mobile phone repair, precision component repair, etc
Syringe design, easy to use, easy to weld, weld joints full of bright not false welding, widely used in component welding repair. Comes with its own flux for easy soldering and is an indispensable soldering supply for the soldering studio.
Lead-free solder paste, the paste is delicate and smooth, and the PCB should be preheated before soldering,The operating temperature is above 300 degrees Celsius
Product features
Product features
Materials and care
Materials and care
Merchandising tips
Merchandising tips
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